Advantest A01020 LOVDC Cable
Flexible Platform Spans from Wafer to High-End Power Module Testing
EXAVIS platform is able to address emerging wide-bandgap semiconductor (e.g., Silicon carbide (SiC) and Gallium nitride (GaN)) challenges, as well as the integration of digital IP cores on power devices (e.g., Intelligent power module (IPM) and Integrated power device (IPD)),
providing high bandwidth capture instrument, best-in-class gate driver control, dynamic (and short-circuit) test up to 10kA, and flexible high-voltage digital capabilities.
Aligned with Advantest’s history of providing scalable test platforms, EXAVIS distributed computing architecture provides significant multisite test efficiency, enabling a high-parallel-test solution with optimized throughput.
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Advantages and Benefits
Unified Power Test Platform
Replace multiple legacy testers with a single scalable system.
Support both DC and AC power testing with high current and high voltage test capabilities.
Modular & Scalable Architecture
Modular racks allow flexible and upgradable configurations.
Support parallel sequential and alternate testing, with full digital synchronization.
Software & Test Efficiency
EXAVIS software enables machine-independent test development, simulation, and debugging.
The software technology optimizes the tester resources distribution to provide the best test efficiency.
High Integration & Compact Footprint
Significant footprint reduction compared to traditional setups.
Designed for turnkey automation & compatibility with various handler/prober.