AMAT 0195-10215 High-Precision Pedestal Assembly
AMAT 0195-10215: High-Precision Pedestal Assembly
The AMAT 0195-10215 is a critical hardware component manufactured by Applied Materials (AMAT), specifically designed for use in semiconductor fabrication equipment.
This component typically functions as a part of the Heater Pedestal or Wafer Support Assembly within Chemical Vapor Deposition (CVD) or Etch chambers.
Its primary role is to provide a stable, thermally controlled environment for silicon wafers during high-temperature processing.
Technical Parameter Table
| Parameter | Specification |
| Manufacturer | Applied Materials (AMAT) |
| Part Number | 0195-10215 |
| Component Type | Pedestal / Heater Assembly Support |
| Material Composition | High-purity Ceramic / Aluminum Alloy |
| Compatibility | Centura, Endura, and Precision 5000 Platforms |
| Operating Temperature | Up to 450°C – 600°C (Process dependent) |
| Dimensions | Standard 200mm / 300mm compatibility |
| Vacuum Rating | High Vacuum (HV) compatible |
Product Advantages and Features
Thermal Uniformity: Engineered to ensure even heat distribution across the wafer surface, preventing thermal stress and ensuring consistent thin-film deposition.
Corrosion Resistance: Constructed with specialized coatings to withstand aggressive precursor gases and plasma environments.
Precision Alignment: Features high-tolerance machining to ensure the wafer is perfectly centered, reducing edge-exclusion zones.
Durability: Designed for high-cycle reliability in 24/7 manufacturing environments, minimizing “Mean Time Between Forced Outages” (MTBFO).
Unique Product Description
The AMAT 0195-10215 represents the pinnacle of vacuum-compatible thermal engineering. Unlike standard supports, this assembly integrates advanced material science to bridge the gap between mechanical stability and thermal agility.
It acts as the “foundation” of the process chamber, ensuring that every nanometer of deposited material adheres to the strict specifications required for modern logic and memory chips.
Application Cases
CVD (Chemical Vapor Deposition): Supporting the wafer during the deposition of dielectric or metallic layers.
PECVD (Plasma Enhanced CVD): Providing the electrical grounding and thermal bias necessary for plasma stability.
Etch Processes: Maintaining wafer temperature during high-energy ion bombardment to prevent photoresist burning.
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Applied Materials utilizes a modular numbering system. Related components often found in the same sub-assembly include:
0190-XXXXX Series: Standard Heater Plates and Pedestals.
0010-XXXXX Series: Chamber Liners and Shields.
0195-10216: Often a companion bracket or electrical interface for the 10215 model.
0195-20001: High-temperature variant for specialized epitaxial growth.
Installation and Maintenance
Warning: Maintenance should only be performed by certified Field Service Engineers (FSE) using Cleanroom-approved tools.
De-installation: Ensure the chamber is vented to Atmosphere and cooled to below 40°C.
Inspection: Check for ceramic cracking or “pitting” on the surface which can lead to wafer contamination.
Torque Specs: When installing the 0195-10215. follow specific AMAT torque sequences to prevent vacuum leaks or mechanical binding.
Cleaning: Use only approved solvents (like Isopropyl Alcohol) and lint-free wipes; never use abrasive materials on the polished surfaces