AMAT 0190-22967 High-Density Analog I/O Control Board
AMAT 0190-22967: High-Density Analog I/O Control Board
The Applied Materials (AMAT) 0190-22967 is a high-performance Analog Input/Output (AIO) PCB designed for the CompactPCI (cPCI) bus architecture.
Manufactured by MKS Instruments (Tenta) specifically for Applied Materials tools, this module acts as a high-density signaling bridge.
It is a critical component in 300mm semiconductor fabrication platforms, responsible for managing the precise feedback loops required for gas flow, pressure, and power monitoring.
Technical Parameter Table
| Parameter | Specification |
| Manufacturer | MKS Instruments / Tenta (for Applied Materials) |
| Part Number | 0190-22967 |
| Secondary P/N | AS00700-08 / PB00700-02 |
| Bus Architecture | 3U CompactPCI (cPCI) |
| I/O Configuration | 32 Analog Inputs / 16 Analog Outputs |
| PCB Revision | Commonly Rev. 002 / Rev. E2 |
| Signal Resolution | 16-bit High Precision |
| Form Factor | Standard 3U cPCI Card |
| Compliance | SEMI S2, CE, RoHS |
Related Models
The 0190-22967 (AS00700-08) is an evolution of the analog control series and is often found alongside:
0190-22543 (AS00700-02): Standard density Analog I/O board (often the 16/8 channel variant).
0190-07450 (AS00710-02): 48-Channel Digital I/O (DIO) Card.
0190-16926: 4-Channel DeviceNet Scanner Card.
0190-17964: Etch DPS Interlock Module (DIP-210-016).
Application Cases
This high-density board is primarily deployed in 300mm AMAT tools like the Producer GT, Centura, and Endura platforms:
Multi-Zone Heater Control: Managing independent analog setpoints for complex 300mm wafer heaters to ensure thermal uniformity.
Complex Gas Delivery: Interfacing with large banks of Mass Flow Controllers (MFCs) in multi-chamber deposition systems.
Advanced Plasma Monitoring: Tracking forward and reflected RF power signals in DPS II (Decoupled Plasma Source) Etch chambers.
Chamber Pressure Management: Receiving analog feedback from MKS Baratron capacitance manometers to drive throttle valve adjustments.
Product Advantages and Features
0190-22967
High Port Density: By offering a 32/16 channel configuration, it allows for the control of twice as many peripherals in a single cPCI slot compared to standard boards.
Low-Noise Engineering: Features advanced EMI shielding and filtered circuitry to maintain signal integrity in the high-frequency noise environment of a plasma fab.
Deterministic Real-Time Control: Leverages the cPCI backplane for high-speed, synchronous data processing, essential for maintaining stable process recipes.
Industrial Grade Reliability: Built to AMAT’s strict Mean Time Between Failure (MTBF) standards to support 24/7 high-volume manufacturing.
Other Models in the Same Series
The 0190-22XXX and AS00700 lineage defines the analog capabilities of the tool:
AS00700-01: Early-revision analog I/O configuration.
AS00700-02 (0190-22543): The standard “Gold” version for baseline chamber control.
AS00700-08 (0190-22967): The high-density expansion version for complex multi-zone heater or magnet control.
Installation and Maintenance
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Installation: Align the board with the 3U guide rails in the electronics rack. Using the injector/extractor handles, firmly seat the high-density backplane connectors. Secure the front panel with captive screws to ensure proper grounding.
ESD Protocol: This module contains sensitive high-resolution A/D and D/A converters. Always use a grounded ESD wrist strap when handling.
Calibration: After replacement, a “Zero and Span” software-based calibration is typically required within the tool’s diagnostic interface to align the board’s electrical offsets with the tool’s sensors.
Inspection: Periodically check the high-density front connectors for bent pins or debris, as these can cause high-resistance errors in analog signal readings.
Unique Product Description
The AMAT 0190-22967 is the “central nervous system” for analog data in high-end semiconductor processing.
While digital signals handle on/off tasks, this board manages the nuanced gradients of voltage and current that determine the success of a nanometer-scale etch or deposition.
Its high-density architecture allows 300mm tools to scale in complexity without increasing the physical size of the control rack, providing the precision and stability required for the industry’s most demanding fabrication nodes.